基于空间插值的温室三维温度场构建方法比较研究

doi:10.13733/j.jcam.issn.2095-5553.2025.06.026

摘要/Abstract

摘要：

为确定适用于温室三维温度场构建的空间插值方法及插值分辨率，基于Venlo型玻璃温室中布设的27个温度传感器观测数据，使用反距离权重插值（IDW）、径向基函数插值（RBF）及普通克里金插值（OK）3种空间插值方法构建温室三维温度场，分析插值精度，比较8种不同空间插值分辨率对插值效率的影响。结果表明，IDW、RBF、OK的温度预测值与实测值均呈显著正相关关系（P<0.05,R2分别为0.928、0.911、0.957），平均绝对误差和均方根误差分别为0.766 ℃、0.765 ℃、0.599 ℃和1.266 ℃、1.449 ℃、0.981 ℃，其中OK构建的三维温度场效果最优。此外，与1 cm插值分辨率相比，20 cm分辨率下预测值的均方根误差为0.025 ℃，可在保证插值精度的条件下，减少99.96%的运算时间，可作为适宜的空间插值分辨率进行温度场构建。

关键词: 三维温度场, 传感器, 空间插值, 空间分辨率, 温室

Abstract:

In order to determine the spatial interpolation method and interpolation resolution suitable for the construction of the 3D temperature field of the greenhouse, based on the observation data of 27 temperature sensors installed in the Venlo type glass greenhouse, three spatial interpolation methods, namely inverse distance weight interpolation (IDW), radial basis function interpolation (RBF) and ordinary Kriging interpolation (OK), were used to construct the 3D temperature field of the greenhouse. The interpolation accuracy was analyzed, and the effect of 8 different spatial interpolation resolutions on the interpolation efficiency was compared. The results showed that the predicted values of IDW, RBF and OK were significantly positively correlated with the measured values (P<0.05, R2 were 0.928, 0.911, 0.957, respectively). The mean absolute errors and root mean square error were 0.766 ℃, 0.765 ℃, 0.599 ℃ and 1.266 ℃, 1.449 ℃, 0.981 ℃, respectively. Among them, the three‑dimensional temperature field constructed by OK has the best effect. In addition, compared with the interpolation resolution of 1 cm, the root mean square error of the predicted value at the resolution of 20 cm was 0.025 ℃, which can reduce the operation time by 99.96% under the condition of ensuring the interpolation accuracy, and can be used as a suitable spatial interpolation resolution for temperature field construction.

Key words: three?dimensional temperature field, sensor, spatial interpolation, spatial resolution, greenhouse

中图分类号:

S625.5

夏皓, 刘杨, 贡宇, 任妮, 金晶. 基于空间插值的温室三维温度场构建方法比较研究[J]. 中国农机化学报, 2025, 46(6): 176-182.

Xia Hao, , Liu Yang, , Gong Yu, Ren Ni, Jin Jing. Comparison study on the construction methods of three‑dimensional temperature field in a greenhouse based on spatial interpolation[J]. Journal of Chinese Agricultural Mechanization, 2025, 46(6): 176-182.

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